Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate

Product Details
Customization: Available
Application: Aerospace, Automotive Manufacturing, Electronic device, Solar Panel, Insulators
Color: Amber
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  • Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate
  • Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate
  • Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate
  • Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate
  • Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate
  • Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate
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Basic Info.

Thickness
0.025mm, 0.010mm, 0.050mm
Young’s Modulus
>=3.1gpa
Coefficient of Thermal Expansion
<27ppm/Degree
Type
Insulation Film
Chemistry
Organic Insulation
Classification
Organic Insulating Material
Certification
ISO9001
Transport Package
Carton and Pallet
Origin
China
HS Code
392169000
Production Capacity
15000kg/Month

Product Description

Widely Used Polyimide Pi Film with Excellent Properties

Application/Model
Our products apply to national defense industry aerospace industry, electric motor industry, FPC and TAB of electronic industry, Grade H, C insulating materials (pulling motor, submersible oil electric motor , nuclear power equipments, high-temperature-resistant materials, special electric appliances, fire-proofing bus duct, gas mask, loudspeaker voice skeleton), our products polyimide films as parent metal is the best choice of FPC, PST, flexible copper layer plate, LED and high-temperature insulated materials. 
Welcome to consult.

 
Items Units Product model Test Conditions Standard
Thickness   μm 13-14 23ºC ASTM D374
Tensile strength TD MPa 170 23ºC ASTM D882
MD 170  
Elongation TD % 65 23ºC ASTM D882
MD 65  
Young's Modulus   GPa 3.1 23ºC ASTM D882
Dielectric Constant     3.5±0.4 1MHz 23ºC ASTM D150
Dielectric Dissipaion Factor     0.004 1MHz 23ºC ASTM D150
Volume Resisticity   Ω•cm >1012 500V 23ºC ASTM D257
Surface Resistivity   Ω >1014 500V 23ºC ASTM D257
Dielectric Strength   v/μm ≥200 23ºC ASTM D149
CTE   Ppm/ºC 30±5
30±5
100~200ºC
200~300ºC
ASTM D696
Shrinkage Rate   % 0.08 200ºC,2Hr ASTM D5213-04
Water Absorption   % 2.2 23ºC,soak for 24Hr ASTM D570
Density   g/cm³ 1.44±0.2 23ºC ASTM D1505
Wetting Tension   mN/m 60 23ºC IEC674-2


Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate

Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad LaminateFactory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate
Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate

Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate

Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate
Factory Supply Amber Polyimide Film for Fccl / Flexible Copper Clad Laminate

 

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