12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)

Product Details
Customization: Available
Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor
Color: Yellow
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  • 12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
  • 12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
  • 12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
  • 12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
  • 12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
  • 12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
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  • Overview
  • COMPANY INTRODUCTION
  • DATA SHEET
Overview

Basic Info.

Thermal Rating
H 180
Thickness
0.025mm, 0.050mm
Young’s Modulus
>=3.1gpa
Coefficient of Thermal Expansion
<27ppm/Degree
Insulation
Electrical Insulation
Temperature
High Temperature Resistance
Protection
Protection of FPC
Film
Kapton Film
Label
Pi Label
Type
Insulation Film
Chemistry
Organic Insulation
Classification
Organic Insulating Material
Certification
ISO9001
Transport Package
Carton and Pallet
Origin
China
HS Code
3920920000
Production Capacity
15000kg/Month

Product Description

 
COMPANY INTRODUCTION

Shandong Xinhongyun New Material Technology Co., Ltd.Located in Weifang city, Shandong province., is an ISO-certified professional & reliable manufacture of electrical insulation materials-BOPI FILM(polyimide film). our annual production capacity is 150-200MT.main thickness 12.5um,25um & 50um, main width 514mm,520mm,1028mm&1040mm.main color: yellow, red, matte black.
we have a strict quality inspection system, we trust we can supply you the best quality product with high quality

Polyimide (PI) is a polymer of imide monomers, also known as heat resistant film or high-temperature film. With their high heat resistance, polyimide enjoys diverse applications in roles demanding rugged organic materials. Polyimide film is ideal for insulating circuit boards, high-temperature powder coating, and transformers manufacturing.
Polyimide film provides excellent electrical, thermal, physical, and chemical properties over a wide temperature range between -269ºC (-452ºF) and 400ºC (752ºF) making them superior for electrical insulation applications. Polyimide film can be laminated, metalized, punched, formed, or adhesive coated. It is the recommended choice for applications that require an all-polyimide film with an excellent balance of properties over a wide range of temperatures.
we can provide both standard and custom polyimide film solutions for a customer depending on their needs.
DATA SHEET
NO. Items
Uint

Request
Analysis result
1 Appearance --
Film surface smooth, no obvious defects and debris, clean edge without damage
Pass
2
Thickness
μm 12.5±0.5 12.9
3
Tensile strength
Mpa MD≥220 225
TD≥220 223
4 Elongation at break % MD≥50 55
TD≥50 63
5
Young's Modulus
MPa MD≥3100 3465
TD≥3100 3285
6
Electric strength
MV/m ≥235 343
7
Shrinkage
% MD±0.2 0.17
TD±0.2 -0.01
8
Surface tension
Dyne/cm ≥58 60
NO. Items
Uint

Request
Analysis result
1 Appearance --
Film surface smooth, no obvious defects and debris, clean edge without damage
Pass
2
Thickness
μm 25±1 24.9
3
Tensile strength
Mpa MD≥165 219
TD≥165 201
4 Elongation at break % MD≥50 62
TD≥50 60
5
Young's Modulus
MPa MD≥3000 3244
TD≥3000 3225
6
Electric strength
MV/m ≥235 284
7
Shrinkage
% MD±0.1 -0.02
TD±0.1 -0.03
8
Surface tension
Dyne/cm ≥58 60

Product & packing picture

 
12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
 
12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)

Lead Time:
Quantity(KGS) 1-20 21-500 501-2000 >2000
Est.Time(Days) 5 10 15 To be negotiated



Applications

Wire&cable Insulation, slot liner insulation,interlayer insulation in Motor,transformer etc.
Backing material for Polyimide coating or composites
Flexible Printed Circuits Board(F-PCB)
Polyimide Label
Polyimide tubing


FCCL membrane PI in LED lights PCB
12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)

Coverlay film in FPC/PCB

12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)



High-temp cables wrapped PI PI in die-cutting

12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)

PI in battery Black PI tape

12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)
CERTIFICATIONS
12.5/25um *520/1040mm 6052 Bopi Polyimide Film Substrates for Flexible Printed Circuit (FPC)


FAQ

Q1:Are you a trading company or manufacturer?
We are a manufacturer, We have our own workshop producing electrical insulation polyimide film.
Q2: Can you send samples for testing?
A4 size Samples & Small rolls are free supplied, customers just need to pay a litter shipping charge.
Q3: How can you guarantee the quality of mass goods is the same as the sample sent to me before?
We kept another same sample and marked it on the company when we sent it to the customer. So our products will be based on and also we will test the product before shipment.
Q4: Which package do you use?
The package is an important part to avoid goods breaking in transportation. We will choose suitable packing depending on the materials.


Package&Storage:

Packed in rolls and carton; store at room temperature; avoid fire. The storage period is 12 months.

If you are interested please do not hesitate to contact us.
 

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