1040 mm Pi Film for Coverlay of Fccl

• Customization: Available
• Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor
• Color: Yellow
• Thickness: 0.025mm, 0.010mm, 0.050mm
• Young’s Modulus: >=3.1gpa
• Coefficient of Thermal Expansion: <27ppm/Degree
• Type: Insulation Film
• Chemistry: Organic Insulation
• Classification: Organic Insulating Material
• Certification: ISO9001
• Transport Package: Carton and Pallet
• Origin: China
• HS Code: 392169000
• Production Capacity: 15000kg/Month

Product Description

Widely Used Polyimide Pi Film with Excellent Properties

Application/Model
Our products apply to national defense industry aerospace industry, electric motor industry, FPC and TAB of electronic industry, Grade H, C insulating materials (pulling motor, submersible oil electric motor , nuclear power equipments, high-temperature-resistant materials, special electric appliances, fire-proofing bus duct, gas mask, loudspeaker voice skeleton), our products polyimide films as parent metal is the best choice of FPC, PST, flexible copper layer plate, LED and high-temperature insulated materials. 
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Items		Units	Product model	Test Conditions	Standard
Thickness		μm	13-14	23ºC	ASTM D374
Tensile strength	TD	MPa	≥170	23ºC	ASTM D882
	MD		≥170
Elongation	TD	%	≥65	23ºC	ASTM D882
	MD		≥65
Young's Modulus		GPa	≥3.1	23ºC	ASTM D882
Dielectric Constant			3.5±0.4	1MHz 23ºC	ASTM D150
Dielectric Dissipaion Factor			≤0.004	1MHz 23ºC	ASTM D150
Volume Resisticity		Ω•cm	>10^12	500V 23ºC	ASTM D257
Surface Resistivity		Ω	>10^14	500V 23ºC	ASTM D257
Dielectric Strength		v/μm	≥200	23ºC	ASTM D149
CTE		Ppm/ºC	30±5 30±5	100~200ºC 200~300ºC	ASTM D696
Shrinkage Rate		%	≤0.08	200ºC,2Hr	ASTM D5213-04
Water Absorption		%	≤2.2	23ºC,soak for 24Hr	ASTM D570
Density		g/cm³	1.44±0.2	23ºC	ASTM D1505
Wetting Tension		mN/m	60	23ºC	IEC674-2